bt sip package substrate

Brand Name:Horexs

Place of Origin:china

... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or

Place of Origin:CN

Brand Name:Original Factory

Model Number:BGM123N256V2

BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% Low Price Guaranteed + Export to 108 ...

Brand Name:Mingseal

Model Number:FS600A

Place of Origin:China

... for Dam & Fill and SiP Packaging The FS600 Series Inline Visual Dispensing Machine is an intelligent, cost-efficient solution developed specifically for Dam & Fill processes and SiP (System in Package) semiconductor packaging. With an optimized price...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:Loranger

Model Number:Single Inline Pin (SIP) Sockets

...SIP Packages Modified and Custom Sockets Available May Accommodate More than One Package Fit is Independent of Package Body L, W and H Various Pitches Available Item # Item Name Package Name Number of Input/Output (I/O) Pitch 02905 041 6215 4 Input/Output (I/O) and 2.54 Millimeter (mm) Pitch Single Inline Pin (SIP) Socket SIP...

Brand Name:YJJ

Model Number:S6967 S6967-01

Place of Origin:USA

...Photodiode Plastic SIP Package For Detection In Visible Light To Near-Infrared Range Features: Plastic SIP (Single In-line Package) S6967 is a silicon PIN photodiode with a large light-receiving surface, molded into a transparent plastic SIP, used for ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:OEM

Model Number:YSPBOX-21919

Place of Origin:China

Custom logo Printed apparel clothing garment bt shirt packaging boxes for t-shirt Tshirt packaging box have been a huge hit in e-commerce and kit retail sales. Shown here are a variety of different boxes ranging from pet care, men’s cooking supplies, and...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:ADI

Model Number:MAX14722ATP+

Place of Origin:USA

Product Description: Passive IC Components are essential components used in electrical and electronic circuits, with a wide range of applications such as industrial, automotive, medical and consumer electronics. They are designed to be resistant to ...

Model Number:GS-DHT11

Place of Origin:China

Overview : DHT11 digital temperature and humidity sensor is a calibrated digital signal output temperature and humidity Composite sensor. It uses a dedicated number Word module acquisition technology and temperature and humidity sensing technology to ...

Brand Name:SHENHUA

Model Number:SC820

Place of Origin:Guangdong, China

...Sip packaging in line auto cleaning system for advanced semiconductor package process. SC820 is precise, high quality, SIP packaging deflux cleaning system. SC820 SIP package auto cleaing machine is used to clean flux residuals, soder balls and particles on sip package...

Brand Name:BT PCB

Model Number:Varies by goods condition

High-Reliability BT Resin PCB for Precision Electronics BT Substrate is a high-performance printed circuit board material composed of Bismaleimide (BMI) and Triazine (TZ) resins, reinforced with glass fiber or ...

Brand Name:NOKIA

Model Number:ASIM

Place of Origin:CHINA

..., ion-implanted substrates, and lightly doped source and drain regions. All regions of transistor operation can be simulated using ASIM including the triode, saturation and subthreshold ...

Brand Name:JDC

Model Number:GRA

Place of Origin:CHINA

... process controls are used in every step of production to insure 'built-in' reliability and consistent quality. FEATURES: Small in size with high precision package It is suitably used in

Categories:IC Substrate PCBs

Country/Region:china

2-Layer Rigid IC Substrate PCBs Green Solder Mask 0.2mm RoHS Compliant *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, svg {...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...

Place of Origin:Guangdong, China

Brand Name:Meraif

...Description with the development of modern semiconductor process, SIP package flux clean is very important . SC820 precise ,high quality and reasonable price SIP package flux auto cleaning machine is used for advanced semiconductor package process. For all

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...