Environmentally Friendly And Reusable Anti-Static Electronics Tray JEDEC Standard Matrix Tray

Environmentally Friendly And ReusabAnti-Static Electronics Tray JEDEC Standard

Component CQFP64G High Temperature Resistant MPPO 150°c

Wireless Electronic Components Turnover Transportation IC ESD Trays

JEDEC trays are reliable, continually proven and operated to handle and process parts in an automated environment.

They have evolved and matured from their beginnings in the semiconductor industry and are used for other types of electronic components, optical and photonic products, and purely mechanical parts.

Pick and place on automated production lines, ESD protection and the use of standardized process equipment are the most common reasons companies choose to use JEDEC trays.

JEDEC Tray Application Areas:

1. Semiconductor Industry
Uses: Originally designed for storing and transporting semiconductor chips, ensuring anti-static protection and physical security.
Advantage: The standardized design of the trays makes automated handling more efficient.

2.Electronic Components
Uses: Widely used for storage and transportation of various electronic components such as resistors, capacitors, integrated circuits, etc.
Advantage: Improved product consistency and traceability.

3.Optical and Photonic Products
Uses: Used for the safe storage and transportation of photonic products such as optical components and lasers.
Advantage: Provides the necessary protection against damage to optical components.

4.Mechanical parts
Uses: In machine manufacturing, JEDEC pallets are used to store and transport a variety of mechanical parts.
Advantage: Standardized pallet design helps increase productivity and reduce error rates.

JEDEC trays are available in a variety of types, each designed for specific applications and requirements for handling and storing electronic components:

1.Electrostatic Discharge (ESD) Tray
DESCRIPTION: Made of anti-static material to prevent static buildup and protect sensitive electronic components: Made of anti-static material to prevent static buildup and protect sensitive electronic components.
Applications: Ideal for handling integrated circuits, transistors and other electrostatic discharge sensitive devices.

2.Customized Trays
DESCRIPTION: CUSTOMIZABLE TO SIZE AND REQUIREMENTS: Customized to specific requirements for size, shape and component layout.
Application: Used when standard trays cannot meet the special requirements of certain trays.

3. Hot Tray
DESCRIPTION: Hot pallets are designed to withstand high temperatures and are often used in processes involving reflow soldering.
Application: For components that need to be exposed to high temperatures during the manufacturing process.

4. Optical Tray
DESCRIPTION: Designed for optical components to ensure that they are exposed to high temperatures during manufacturing: Designed for optical components to ensure that they are protected from scratches and contamination.
Applications: For lenses, mirrors and other sensitive optical devices.

5. Mechanical Trays
DESCRIPTION: For placing and transporting mechanical parts: Used for placing and transporting mechanical parts, often with a reinforced design to withstand heavier loads.

Application: For a variety of mechanical parts in manufacturing environments.

Each JEDEC pallet is designed to meet the specific handling, storage and transportation needs of the electronics manufacturing industry. Selecting the correct type depends on the components handled and the requirements of the production process.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/