Sign In | Join Free | My rc363.com
rc363.com
Products
Search by Category
Wholesale Marketplace
Home > Environmental Machinery >

GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

Categories Glue Micro Dispenser
Brand Name: MingSeal
Model Number: GS600SW
Certification: ISO CE
Place of Origin: China
MOQ: 1
Price: $1000-$150000
Payment Terms: L/C, T/T, D/A, D/P, MoneyGram, Western Union
Delivery Time: 5-60 days
Packaging Details: WOODEN
Condition: New
Voltage: 110V/220V
Automatic grade: Automatic
Warranty: One Year
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill

SS101 Wafer-Level Dispensing Machine


For Wafer Form Underfill

SS101 is a highly stable and precise wafer level dispensing system which is developed based on Under fill process requirements of RDL First WLP.

The equipment meets the needs of the semiconductor industry,can be provided with an automatic wafer loading & unloading system , and can automatically realize functions such as wafer handling , alignment , preheating , operation heating and heat dissipation . It is compatible with international semiconductor communication protocols , and is provided with an AMHS automatic loading & unloading robot interface to match the

information management requirements and unmanned management trends.

SS101 System Layout

➀ Loadport & Foup

➁ Aligner

➂ QR code scanning station

➃ Pre-heating station

➄Heat dissipation station

➅GS600SWA Dispensing Machine work station ➆GS600SWB Dispensing Machine work station

➇Robot Handling module

Composition of SS101 Wafer-Level Dispensing System

  • GS600SW wafer-level dispensing machine × 2
  • PC101 wafer loading & unloading machine × 1

Application Fields

  • RDL First WLP
  • CUF Application

SS101 Wafer-Level Dispensing Operation Flow

QQ截图20230207112218

Features and Advantages

  • Supporting 8/12-inch wafer dispensing.
  • Dustproof level 10, meeting the environmental requirements of wafer level packaging.
  • ESD protection meeting international IEC and ANSI standards.
  • In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety.
  • The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis

Technical Specifications

SS101 systemGS600SWA * 1 ,GS600SWB * 1, PC101 Wafer Handling Machine * 1 (EFEM)
Application FieldsRDL First WLP, CUFApplication
Cleanliness LevelCleanliness of working area

Class 100 (Class 1000 workshop)

Class 10 (Class 100 workshop)


Product Application Fields

Support for wafer size

φ200mm±0 .5mm, φ300mm±0.5mm

(Standard model supports 12-inch wafers only)

Support for wafer thickness300-2550μ m
Allowable wafer max. warpage range<5mm (as per Robot Finger type)
Allowable max.wafer weight600g (as per Robot Finger type)
Wafer cassette form8 inches Open Cassette,12 inches Foup (Standard model supports 12-inch wafers only)


PC101(EFEM)

Loading&unloading methodLoadport+Robots
Pre-Aligner accuracyRound center correction deviation≤±0 . 1mm; Angle correction deviation≤±0 .2 °
Wafer readerSupports SEMI fonts (Flat or concave/convex surfaces) ,non-SEMI fonts
Preheating temp. rangeRoom temperature~180℃
Wafer cooling methodNatural cooling or air cooling


Dispensing Motion System

Transmission mechanismsX/Y: Linear motor Z: Servo motor&Screw module
RepeatabilityX/Y: ±3μ mZ: ±5μ m
Positioning accuracyX/Y: ±10μ m
Max. movement speedX/Y: 1000mm/s Z: 500mm/s
Max. accelerated velocityX/Y: 1g Z: 0 .5g

Vision System

Camera pixels130W
Recognition accuracy±1 Pixel
Recognition range12 × 16mm<Recognition range<19 .2 ×25 .6mm
Light sourceCombined three-color light source red, green, white + red
Weighing Calibration SystemWeighing accuracy0.01mg


Chuck Table Load Tray

Vacuum surface flatness deviation≤ 3 0 um
Heating temp.rangeRoom temperature~180℃
Heating temp. deviation≤ ± 1 . 5 ℃
Repeatability of lifting height±10 μ m
Vacuum suction pressure-70~-85Kpa Settable





Facilities

Footprint (W*D*H)3075×2200×2200mm(Display unfolded)
Weight2.9t
Power supply200~240VAC,47~63HZ (Single-phase voltage adaptation power supply)
Electric current75A
Power16.5KW
Inhale(0.5Mpa, 450L/min) ×5 way
Operating ambient temp.23℃±3℃
Relative humidity of working environment30 ~ 70%

Quality GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill for sale
Send your message to this supplier
 
*From:
*To: Changzhou Mingseal Robot Technology Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0