384x288 Resolution 17μm Pixel Size LWIR Uncooled Thermal Imaging Camera Core for Industrial Vision

The COIN417G3 infrared camera core integrates a 384×288/17μm wafer-level infrared detector paired with upgraded professional image processing algorithms for instant, smooth thermal image output. With low power consumption and industry-wide standard interface compatibility, this cost-effective thermal module achieves a typical NETD lower than 30mK for highly sensitive thermal detection. Supporting versatile output interfaces including USB2.0, DVP, LVDS and BT.656, it delivers both RAW and YUV image data with serial port control access. Built for seamless secondary development and rapid system integration, it accelerates product iteration for industrial vision, night security surveillance, outdoor observation, AIoT and ADAS intelligent driving applications.

• Comprehensive Functionality, Cost-Effective Design
  Developed using a high cost-performance wafer-level packaging detector. Integrated with advanced image processing algorithms to enhance image quality.
• Outstanding Performance, Superior Imaging
  High sensitivity with a typical NETD≤30mK. Next-generation image algorithms deliver clearer, sharper thermal images.
• Flexible Extension, Rapid Integration
  Multiple optical lens options available to suit diverse application scenarios. Supports USB2.0/DVP/LVDS/BT.656 image output interfaces. Outputs RAW/YUV image data with serial port control.

The COIN417G3 thermal camera core is widely used in Industrial Vision, Security Monitoring, Firefighting & rescue, Outdoors, Machine Vision, ADAS etc.

• Complete Documentation: Product manuals, setup guides, and selection references. Get started without guesswork.
• Development & Testing Assistance: Sample Integrated Testing, performance evaluation, and parameter verification made easy.
• Advanced Developer Toolkit: SDKs, APIs, algorithms, and debugging tools for deep integration.
• Remote Technical Support: 24/7 support--quick response and timely resolution for critical issues.
• Warranty: Original parts and strict process adherence to restore optimal performance.

Metal packaging uses metal tube shell, thermoelectric cooler (TEC) and columnar getter. The TEC plays an important role of stabilizing the working temperature so that the infrared detector works at room temperature, thereby improving the ability of thermal imaging sensors to adapt to extreme environments, such as heavy fog, rain and snow etc.

But the disadvantage is that the cost is too high, accounting for more than 60% of the total cost of the entire uncooled products production, and causing a long production cycle. Such packaging method is for high-end applications.